Adhesives for Cleaving
A temporary adhesive. These wash away adhesives are used as a temporary bond for holding delicate crystals, metallurgical specimens, glass components, and ceramic substrates for dicing, slicing, drilling and polishing. These materials adhere readily to metals, glass, ceramic and then can be washed after machining away using various solvents.
- Machining or slicing single crystal metal specimens.
- Grinding and polishing sapphire, ceramic, optical garnets, ferrites, and LCD glass.
- Dicing and slicing germanium and silicon wafers in semiconductor production.
- Dicing and slicing alumina and beryllia substrates for IC and microelectronic production.
- Holding beam leads in IC devices for pull-off tests.
- Dicing subminiature chip capacitors and microwave IC substrates.
|Description:||Thermo polymer*||Thermo polymer*||Thermo polymer*|
|Form:||7/8"Dia.x7" stick||Lump||Rectangle stick|
|Softening:||160°F (71°C)||125°F (52°C)||257°F (125°C)|
|Flow Point:||250°F (121°C)||130°F (54°C)||302°F (150°C)|
|Viscosity at Flow Point:||6,000 cps||500 cps||9,000 cps|
|Solvent:||Acetone or 509 Stripper||Water||Methanol or 590-S Stripper|
Offers excellent adhesion to metals, glass, and ceramic. This material is the best for precise high purity work since it leaves no residue after dissolving and does not clog the diamond wheel as compared to conventional waxes. Each stick weighs about 90 grams.
|50400-01||Crystalbond 509 Sticks||1 Stick||32.00||Add to Cart|
|50400-05||Crystalbond 509 Sticks||5/pk||148.00||Add to Cart|
|50400-50||Crystalbond 509 Amber Stick||each||32.00||Add to Cart|
|50400-S1||Crystal Bond 509 Stripper||1 qt||110.00||Add to Cart|
|50400-S2||Crystal Bond 509 Stripper||1 gal||170.00||Add to Cart|
The same as 509 but used in applications where it is desirable to have a temporary bond which is water soluble. Each stick weighs about 90 grams.
|50401-01||Crystalbond 555 Sticks||1 Stick||24.00||Add to Cart|
|50401-10||Crystalbond 555 Sticks||10/pk||216.00||Add to Cart|
The same as 509 but offers maximum adhesion to subminiature parts. Each stick weighs about 225 grams.
|50402-01||Crystalbond 590 Sticks||1 Stick||45.00||Add to Cart|
|50402-02||Crystalbond 590 Sticks||2/pk||82.00||Add to Cart|
|50402-S||Stripper for Crystalbond 590||100gr||34.00||Add to Cart|
Available in sheet form 10"x10" (254x254mm). To use, remove the paper backing exposing the adhesive layer. The substrate is positioned on the film and pressed down firmly so that it adheres to the plastic film. No heating is required. The wafer mounted on the plastic film can then be held down using a vacuum manifold or mechanical means for dicing or scribing. After dicing or scribing, the parts can be separated from the wafer-mount 559 film by washing in acetone or MEK. Ideal for holding down silicon wafers, alumina, or glass substrates for scribing.
Sheet 10"x10" (254x254mm). Press down firmly to adhere substrate to film. No heating is required. Ideal for holding down silicon wafers, alumina, or glass substrates for scribing. Dissolves in acetone or MEK
|50403-02||Wafer-Mount 559||2/pk||32.00||Add to Cart|
|50403-10||Wafer-Mount 559||10/pk||140.00||Add to Cart|
A dry temporary adhesive film, 0.003" thick, which can be easily cut to size with either a razor or scissor. This mount permits pre-placement of the adhesive film exactly where the user wants it. It melts at 195-210°F. After application it can be dissolved rapidly in trichloroethylene or toluene. This material is particularly useful in applications where a pre-formed adhesive film is needed to assure uniform bonding and flatness or in bonding stacks of substrates such as LCD glass slides for slicing. Sheet size 8"x10".
|50404-10||Wafer-Mount 562||10/pk||82.00||Add to Cart|
|50404-20||Wafer-Mount 562||20/pk||162.00||Add to Cart|