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Electron Microscopy Sciences

Cleaving and Scribing Systems and Tools

arrow13Scribing Machine

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LatticeAx™ FlipScribearrow11FlipScribe™

FlipScribe™ takes scribing to a new performance level, making clean, straight scribe lines on the back side to accurately cleave front side targets, bonded wafers and other substrates. This method eliminates contamination of sensitive front side devices during the scribing processes and is valuable for both crystalline and amorphous samples.

FlipScribe
Faceted diamond scribe; blue line across cutting edge
FlipScribe
Pair the FlipScribe with a LatticeAx™ cleaving machine to fully support a complete, high accuracy scribe and cleave workflow; Shown here: LatticeAx™ 420
FlipScribeSilicon device after scribing and cleaving
FlipScribe
FlipScribe has a small footprint, allowing it to be placed on any work surface
Scribing Reinvented

FlipScribe is a compact, stable, accurate, fast and low cost scribing and cleaving solution suitable for any lab; no utilities required. It provides a more accurate method for scribing than can be achieved with hand held tools, by integrating a robust diamond scribe into a sample platform with a fence guide design. Time required to align and scribe is about a minute. It allows users to accurately position the scribe mark relative to features on the front side, visualized either by eye or with a user-supplied high magnification microscope. FlipScribe also offers a quick method for cleanly downsizing large samples, with a "scribe stop" to allow the operator to define the length of the scribe.

Benefits
  • Enables accurate cleaving through frontside targets with a scribe made on the backside of the substrate
  • Scribe does not damage the frontside of the sample
  • Accuracy of scribe ±200 µm (achievable)
  • Flexible with respect to sample size and shape
  • Capable of scribing bonded crystalline and amorphous wafers and chips for subsequent cleaving
  • No maintenance required
Features
  • Accurate positioning of the scribe relative to features on the front side (the front side being observed either by eye or with a stereoscope)
  • The length of the scribe can be varied from 1 mm to 100 mm
  • Prealigned diamond scribe in user replaceable cartridge; height and angle adjustable
  • Ruler embedded in platform enables precise and repeatable sample alignment and sizing
  • The tool is purely mechanical; no power required
Specifications
Cleaving accuracy ± 200 µm
Cleaving cycle time 1-2 minutes
Minimum sample size ⅜" /9.5 mm (L) x ¼" /6.3 mm (W) x .01" /300 µm (H)
Maximum sample size 4" (100 mm) wafer; ¼ of 12" (300 mm) wafer; Non-wafer: ⅜" /9.5 mm (L) x ¼" /6.3 mm (W) x .01" /300 µm (H)
Configuration
Rail and guide system Maintains sample orthogonality and method to push the sample when scribing.
Sample platform 7" (178 mm) x 6" (152 mm); ruled to facilitate sample sizing
Scribe stop Sets the length of the scribe; continuously variable >1 mm - 4" (102 mm)
Diamond scribe Pre-installed diamond scriber with an eight (8) point diamond tip tool and 4 facets at 45° angle.
Installment Requirements
Flat work surface No power required. Stereo microscope with parfocal zoom recommended
No assembly required  
Options
LatticeAx™ LatticeAx™ cleaving machine for analysis-ready samples with accuracy to ±10 microns
Small sample cleaver Cleaver for small samples, includes sample holders and cleaving apparatus
Wafer cleaving kit Wafer cleaving kit including pliers and scribers
Accessories:

7670-01

7670-02

7670-03

7670-04

7670-05

7670-06

Ordering

7670 FlipScribe each 6,500.00 Add to Cart
7670-01 FlipScribe Replacement Cartridge each 375.00 Add to Cart
7670-02 2" Square Holder each 280.00 Add to Cart
7670-03 45 Degree Holder With Sample each 480.00 Add to Cart
7670-04 2" Round Wafer Holder each 280.00 Add to Cart
7670-05 3" Round Wafer Holder for FlipScribe each 480.00 Add to Cart
7670-06 4" Round Wafer Holder for FlipScribe each POR Add to Cart

High Accuracy Cleaving Systems arrow13arrow13