French Flag   chineseFlag   japaneseFlag   germanFlag   SpanishFlag   argentinaFlag   mexicoFlag   russianFlag

View Cart || Request a 2017 Catalog

Electron Microscopy Sciences

Equipment

arrow13EMS300T D Dual Target Sequential Sputtering System

Submit a follow up request

PDF DownloadImage Gallery



  • EMS Series Overview
    EMS Series Overview
  •  
  • IMG 2089v3
  • IMG 2091v2
  • IMG 2061v3
  • IMG 2068
  • IMG 2070
  • IMG 2076
    Standard rotating specimen stage – for 4" wafers or individual SEM mounting stubs. Shown with optional dual-channel film thickness monitor
  • IMG 2078
    Optional specimen stage for glass microscope slides and dual-channel film thickness monitor option
  • IMG 2078closeup
    Optional specimen stage for glass microscope slides and dual-channel film thickness monitor option
  • IMG 2080
    Rotary planetary stage and dual-channel film thickness monitor – both EMS300T D options
  • IMG 2080closeup
    Rotary planetary stage and dual-channel film thickness monitor – both EMS300T D options
  • IMG 2085-1
    Standard rotating specimen stage with 4" wafer and optional dual-channel film thickness monitor
  • IMG 2092v3
  • IMG 2050scrncloseup
  • IMG 2014v3
    Lockable emergency stop (e-stop) switch option. Note: Does not inhibit or replace the normal on/off switch function
 

The EMS300T D is a fully automatic, large chamber, dual-head sputter coater ideally suited for thin film applications and for conductive coating of scanning electron microscopy (SEM) specimens. The dual-head configuration allows two different oxidizing or non-oxidizing (noble) metals to be sequentially sputtered without the need to 'break' vacuum. A dual channel film thickness monitor option is available.

Key Features

  • Fully automatic touch screen control – rapid data input, simple operation
  • Dual sputter head – for sequential sputtering of two different metals, ideal for many thin film applications
  • A wide range of oxidizing and non-oxidizing targets are available
  • Large chamber format
  • Optional dual channel film thickness monitor (FTM) module
  • Vacuum shut-down feature – leaves the process chamber under vacuum when not in use – improved vacuum performance
  • Thick film capabilities – up to 60 minutes sputtering time without breaking vacuum
  • Three-year warranty

Product Description

Ideal for sputter coating of large specimens, thin film applications and SEM specimen coating

The EMS300T D is designed for sequentially sputtering a range of oxidizing and non-oxidizing (noble) metals for scanning electron microscopy (SEM) and thin film applications. A key feature of the EMS300T D is its ability to deposit two materials (up to five layers) without the need to break vacuum. For details of available target materials, see Ordering Information.

The EMS300T D comes as standard with a chromium (Cr) target and gold (Au) target.

High-vacuum turbo molecular pumping

The EMS300T D is fitted with an internally mounted 70 L/s turbomolecular pump, backed by a 50 L/m two-stage rotary pump (order separately). A Pirani vacuum measurement gauge (range: 1,000 mbar to 5 x 10-4 mbar) is included, but a full range gauge is available as an option. Typical ultimate vacuum levels of around 5 x 10-5mbar can be expected in a clean system after pre-pumping with dry nitrogen gas.

Dual head sputtering – for sequential sputtering

The EMS300T D has two independent sputtering heads to allow sequential sputtering of two different metals without the need to 'break' vacuum, for example, a thin 'seeding' layer of chromium (Cr) followed by deposition of gold (Au). An automatic shutter mechanism enables cleaning of oxidizing sputter targets and protects the second target and substrate during coatings. For single metal applications one target can be selected.

Specimen stages

The EMS300T D is fitted with a flat rotating specimen stage capable of accepting wafers up to 4"/100 mm in diameter. The rotation speed is variable between preset limits and the stage to sputtering head distance can be adjusted between 25-71 mm. A range of optional specimen stages can be fitted – see Ordering Information.

Molded case with color touch screen

The EMS300T D is presented in a custom molded, one-piece case, allowing easy servicing access. The color touch screen allows multiple users to input and store coating 'recipes'. The case houses all the working components and includes an automatic bleed control that ensures optimum vacuum conditions during sputtering.

The vacuum chamber has an internal diameter of 283 mm/12" and comes with an integral implosion guard. A useful feature of the EMS300T D is 'vacuum shutdown', which enhances vacuum performance by allowing the chamber vacuum to be maintained when the system is not in use.

Rapid data entry

At the operational heart of the EMS300T D is a color touch screen, which allows inexperienced or occasional operators to rapidly enter and store their own process data. For added convenience, a number of typical sputter coating profiles are already stored.

Maintenance

The touch screen interface features maintenance prompts that highlight the time of last clean, coating time since last clean, system 'on time' and time of last service.

Pumping requirement

A suitable rotary vacuum pump is required. The Pfeiffer DUO 6 5m3/hr two-stage rotary vacuum pump (91003) is ideal for this purpose. Dry pumping alternatives are also available. See Ordering Information for more details.

Specimen stages

The EMS300T D has specimen stages to meet most requirements. All are easy-change, drop-in style (no screws) and are height adjustable (except rotary planetary stage). Rotation speed is variable between 14-38 rpm:

Flat rotation stage for 4"/100 mm wafers – fitted as standard.

Flat rotation stage for 6"/150 mm wafers.

Rotation stage – 50 mm Ø. This stage only rotates and has no tilt or height adjustment.

Rotate-tilt stage – 50 mm Ø. With height adjustment (target to stage height variable between 30-80 mm). The tilt angle can be preset (horizontal to 30°).

Rotation stage for glass microscope slides.

Other Options

Extended height chamber for taller specimens.

Dual-channel film thickness monitor (FTM). The optional FTM attachment (6556) consists of a controller and quartz crystal oscillator built into the EMS300T D and a vacuum feed-through, two chamber-mounted crystal holders and quartz crystals.

Specifications

Instrument case 585 mm W x 470 mm D x 410 mm H, total height with coating head open is 650 mm
Weight 36.6 kg
Packed dimensions 725 mm W x 660 mm D x 680 mm H (44.8 kg)
Work chamber Borosilicate glass 283 mm ID x 127 mm H
Safety shield Integral polyethylene terephthalate (PET) cylinder
Display 145 mm W x 320 mm D x 240 mm H color graphic thin film transistor (TFT) display
User interface Intuitive full graphical interface with touch screen buttons, includes features such as a log of the last 100 coatings carried out and reminders for when maintenance is due.
Sputter target Disc-style 57 mm Ø with thickness depending on the targets fitted. One 57 mm Ø x 0.3 mm thick chromium (Cr) target and one 57 mm Ø x 0.1 mm thick gold (Au) target fitted as standard.
Vacuum
High vacuum pumping Internally-mounted, 70L/s air-cooled turbomolecular pump
Rotary pump 5m3hr two-stage rotary pump with oil mist filter
Vacuum measurement Built-in Pirani gauge
Typical ultimate vacuum 5x10-5mbar in a clean system after pre-pumping with dry nitrogen gas
Specimen stage Flat rotation stage for 200 mm/8" and 150 mm/6" wafers fitted as standard. Rotation speed is variable between preset limits. For alternative stages, see Ordering Information.
Processes
Sputtering 0-80 mA to a predetermined thickness (with optional FTM) or by the built-in timer. The maximum sputtering time is 60 minutes (without 'breaking' vacuum and with built-in rest periods)
Services and other information
Gases Argon sputtering process gas, 99.999% Nitrogen venting gas (optional)
Electrical supply 90-250 V 50/60 Hz 1,400 VA including rotary pump
Conformity Power factor correction. Complies with the current legislation (CE Certification) and ensures efficient use of power, resulting in reduced running costs

Ordering Information

EMS300T D Dual-Head, Large-Chamber-Turbo-Pumped Sputter Coater, supplied with 1 x 57 mm Ø x 0.3 mm chromium (Cr) and 1 x 57 mm Ø x 0.1 mm thick gold (Au) target. A flat rotation stage for 6" (152 mm) wafers is included. POR Quote
Rotary pump requirements (needs to be ordered separately)
91003 Edwards RV3 50L/s two-stage rotary pump, with vacuum hose, coupling kit and oil mist filter 2,429.00 Add to Cart
6550-A Diaphragm pump. A "dry" alternative to the standard 91003 oil-based rotary pump complete with vacuum hose, coupling kit and oil mist filter POR Quote
Specimen stages
6790-S Swinging arm stage drive, a stage drive and positioning mechanism which positions the stage under the correct target. Also provides rotation drive to the stage. Rotation Speed Max 38 rpm Min 14 rpm POR Quote
6800-S Rotating specimen stage for 6" (152 mm) wafers, with rotation variable between preset limits. POR Quote
6801 Rotating 50 mm Ø specimen stage with adjustable tilt. The platform has six specimen stub positions for 15 mm, 10 mm, 6.5 mm or ⅛" pin stubs. The stage rotation speed is variable between preset limits. The target to stage height is variable between 0 mm and 42 mm for the standard stage. When used with the extended height cylinder the target to stage height would be an additional 87 mm. POR Quote
6802 50 mm Ø variable height specimen stage with six stub positions for 15 mm, 10 mm, 6.5 mm disc stubs or ⅛" pin stubs. Stage rotation speed variable between preset limits. Note: Target to stage height is variable between 10 mm and 53 mm for the standard stage. The stage is supplied with two mounting pillars; one provides 10 mm to 32 mm target to stage distance and the other 31 mm to 53 mm. An adjustable stop is used to set the height. When used with the extended height cylinder (optional accessory) the target to stage height would be an additional 87 mm. POR Quote
6803 50 mm Ø rotary tilting stage. A rotary planetary style stage with a variable tilt angle from horizontal to 30 degrees. The platform has six positions for either 6.5 mm, 10 mm and 15 mm disc stubs or ⅛" pin stubs. Rotation speed is variable between preset limits. Note: depending upon specimen height, this stage may require the optional extended height cylinder. POR Quote
6804 A 90 mm Ø specimen stage for glass microscope slides (up to two 75 mm x 25 mm slides or a single 75 mm x 50 mm slide). The stage can alternatively accommodate up to six ⅛" SEM pin stubs. The stage rotation speed is variable between preset limits. A gear box is included to allow the optional FTM to be used. POR Quote
Options and Accessories
6805 Dual channel film thickness monitor (FTM). A fully integrated system using the EMS300T D touch screen display for the control and display of all FTM functions. The FTM allows for the automatic termination of the metal sputtering process at a pre-selected thickness value. The rate for the sputtering processes is displayed in nm/min, with a resolution of 0.1 nm. Two FTM crystal holders are fixed in the chamber to give optimal position for both targets and to coat one material per crystal. Operating crystal frequency is in the 5 MHz to 400 kHz operating range. Includes two spare quartz crystals POR Quote
6806 Spare quartz crystal. POR Quote
6807 Extended height vacuum chamber (214 mm in height, the standard chamber is 127 mm high). Ideal for increased source to specimen distance and for coating of larger specimens. POR Quote
6808 Vacuum spigot allows more convenient connection of the vacuum hose to the rear of the EMS300T D when bench depth is limited. POR Quote
6809 A lockable emergency stop (e-stop) switch which can be mounted on top of the system in a position easily accessible for the operator. It is provided with a key to release the knob after activation. Note: the addition of the e-stop does not inhibit or replace the normal On/Off switch function. The e-stop can be retrofitted to existing systems. POR Quote
6810 Full range, active vacuum gauge capable of measurement over the range of 1000 mbar to 5 x 10-9 mbar. Typical ultimate vacuum of the EMS300T D is 5 x 10-5 mbar. Note: this must be factory fitted. POR Quote
6811 Coating shields. Can be fitted to protect large surfaces from coating deposition and can be easily removable for cleaning. POR Quote
6812 Spares kit, including: spare standard glass cylinder, one chromium (Cr) and one (Au) sputtering target, vacuum tubing with coupling insert, argon gas tubing, two sputter head magnets, rotary pump oil mist filter, FTM quartz crystal and fuses. POR Quote
Sputter targets

Note: The EMS300T D is fitted with a 57 mm diameter 0.3 mm thick chromium (Cr) target and a 57 mm diameter 0.1 mm thick gold (Au) target as standard. Other optional targets are available:

3410 57 mm Ø x 0.1 mm Gold POR Quote
3411 57 mm Ø x 0.1 mm Gold/Palladium (80/20) POR Quote
3412 57 mm Ø x 0.1 mm Platinum POR Quote
3413 57 mm Ø x 0.1 mm Nickel POR Quote
3414 57 mm Ø x 0.1 mm Silver POR Quote
3415 57 mm Ø x 0.1 mm Palladium POR Quote
3416 57 mm Ø x 0.1 mm Copper POR Quote
3417 57 mm Ø x 0.3 mm Chromium POR Quote
3418 57 mm Ø x 0.5 mm Tungsten POR Quote
3419 57 mm Ø x 1.5 mm Chromium POR Quote
3420 57 mm Ø x 0.2 mm Tungsten POR Quote
3421 54 mm Ø x 1.5 mm Carbon POR Quote
3422 57 mm Ø x 0.1 mm Aluminium POR Quote
3423 57 mm Ø x 0.1 mm Platinum/Palladium (80/20) POR Quote
3424 57 mm Ø x 1.5 mm Titanium POR Quote
3425 57 mm Ø x 0.3 mm Platinum/Palladium (80/20) POR Quote
3426 57 mm Ø x 0.3 mm Gold POR Quote
3427 57 mm Ø x 0.3 mm Gold/Palladium (80/20) POR Quote
3428 57 mm Ø x 0.3 mm Platinum POR Quote
3429 57 mm Ø x 0.5 mm Titanium POR Quote
3430 57 mm Ø x 0.1 mm Iron POR Quote
3431 57 mm Ø x 0.3 mm Iridium POR Quote
3432 57 mm Ø x 0.1 mm Cobalt POR Quote
3433 57 mm Ø x 0.1 mm Tin POR Quote
3434 57 mm Ø x 0.1 mm Molybdenum POR Quote
3435 57 mm Ø x 0.3 mm Magnesium POR Quote
3436 57 mm Ø x 0.1 mm Tantalum POR Quote
3437 57 mm Ø x 3 mm Indium Tin Oxide (90/10) POR Quote

Plasma Asher arrow13arrow13