Epo-Tek H20S Adhesive
Epo-Tek H20S Adhesive is a modified version of Epo-Tek H20E Adhesive, designed for die stamping and dispensing for chip bonding. It is very reliable, two component, silver-filled epoxy with a smooth thixotropic finish. Short curing cycles and convenient mix ratios prove this product to be very simple to use.
|Number of components||Two|
|Mix ratio by weight||1:1|
|Specific gravity||Part A: 2.03
Part B: 3.07
(Frozen Syringe: 2.67)
|Pot Life||2.5 Days|
|Shelf Life||One year at 23°C
(Frozen Syringe: One year at -40°C)
Minimum Bond Line Cure Schedule
Please note that containers should be kept close when they are not being used. For filled systems, we recommend mixing the contents of container A and B very well before combining them.