Epo-Tek H22 Adhesive
Epo-Tek H22 Adhesive is a two-component, silver-filled epoxy system made for die bonding and sealing hybrid circuit packages.
|Number of components||Two|
|Mix ratio by weight||100:4.5|
|Specific gravity||Part A: 2.03
Part B: 1.03
|Pot Life||16 hours|
|Shelf Life||Six months at room temperature|
Minimum Bond Line Cure Schedule
Please note that containers should be kept close when they are not being used. For filled systems, we recommend mixing the contents of container A and B very well before combining them.