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arrow13EMS 300T D Plus Dual Target Sequential Sputtering System

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arrow14EMS300T D Plus Dual Target Sequential Sputtering System




  • Dual sputtering heads and automatic shutter
  • Standard rotating specimen stage with 4 wafer and optional dual-channel film thickness monitor
  • Rotary planetary stage and dual-channel film thickness monitor - both EMS 300T D Plus option
  • Optional specimen stage for glass microscope slides and dual-channel film thickness monitor

The EMS 300T D Plus is Suitable for multi-layer sequential sputtering of two materials, the EMS 300T D Plus has two independent sputtering heads, which allows sequential sputtering of two metals without the need to break vacuum. The system is fully automated with user defined recipes controlling the pumping sequence, time, number of sputter cycles, and the current used during the process. Unlimited layers of varying thickness from two target materials can be sputtered sequentially by cycling between both targets. When not in use the targets are shuttered for protection from contamination.

Substrates can be coated using non-oxidizing (noble) metals such as gold (Au) and platinum (Pt). For coatings with a fine grain structure iridium (Ir) can also be used. With the high-quality vacuum system the EMS 300T D Plus is also capable of using oxidizing metal targets such as chromium (Cr) and Aluminum (Al) to produce fine films and coatings. The EMS 300T D Plus comes as standard with a chromium (Cr) target and gold (Au) target

Key Features

  • Capable of achieving vacuum of 5 x 10-5 mbar
  • New touch and swipe capacitive screen
  • USB port for upgrades and download of process log files
  • Multiple-user profiles can be set up on one machine
  • New software sorts recipes per user according to recent use
  • 16GB of memory can store more than 1000 recipes
  • New multi-color LED visual status indicator
  • Interchangeable stage options
  • Three sputter heads for large area deposition of different materials
  • Single head selection for small samples

Recommended applications for EMS 300T T Plus

  • Ideal for multi-layer coating
  • Adhesion studies

These products are for Research Use Only.

Improved interface

  • Dual-core ARM processor for a fast, responsive display
  • Capacitive touch screen is more sensitive for ease of use
  • User interface software has been extensively revised, using a modern smartphone-style interface
  • Comprehensive context-sensitive help
  • USB interface allows easy software updates and backing up/copying of recipe files to USB stick
  • Process log files can be exported via USB port in .csv format for analysis in Excel or similar. Log files include date, time and process parameters.
  • 16GB of flash memory can store more than 1000 recipes
  • Quick and easy creation of process sequences with a simple copy, drag and drop operation

Allows multiple users to input and store coating recipes. New feature to sort recipes per user according to recent use.

System prompts user to confirm target material and it then automatically selects appropriate parameters for that material.

Intuitive software allows the most inexperienced or occasional operator to rapidly enter and store their own process data. For convenience a number of typical sputtering and carbon coating profiles are already stored but also allows the user to create their own.

Software detects failure to achieve vacuum in a set period of time and shuts down the process in case of vacuum leak, which ensures pump protection from overheating.

Detachable chamber with built-in implosion guard

Removable glass chamber and easily accessible base and top plate allows for an easy cleaning process. Users can rapidly change the chamber, if necessary, to avoid cross contamination of sensitive samples. Tall chamber option is available for improved uniformity for sputtering and to hold larger substrates.

Dual head sputtering – for sequential sputtering

The EMS 300T D Plus has two independent sputtering heads to allow sequential sputtering of two different metals without the need to 'break' vacuum, for example, a thin 'seeding' layer of chromium (Cr) followed by deposition of gold (Au). An automatic shutter mechanism enables cleaning of oxidizing sputter targets and protects the second target and substrate during coatings. For single metal applications one target can be selected.

Multiple stage options

The EMS 300T D Plus has substrate stages to meet most requirements. All are easy-change, drop-in style (no screws) and are height adjustable (except the rotary planetary stage). A swinging arm stage drive is supplied as standard, which is a stage drive and positioning mechanism that positions the stage under the correct target. Rotation speed is variable between 14-38 rpm.

In addition a flat, adjustable stage capable of accepting 4" (101.6 mm) wafers is supplied as standard with the EMS 300T D Plus.

As an accessory, a 6" wafer stage is available, which is a flat adjustable stage capable of accepting 6" or 150 mm wafers. The stage includes two masks for improving uniformity of coating.

Rotation stage – 50 mm Ø. This stage only rotates and has no tilt or height adjustment.

Rotate-tilt stage – 50 mm Ø. With height adjustment (target to stage height variable between 30-80 mm). The tilt angle can be pre-set (horizontal to 30°).

Rotation stage for glass slides – 25 mm x 76 mm

Safety

The EMS 300T D Plus meets key industry CE standards

  • All electronic components are protected by covers
  • Implosion guard prevents user injury in event of chamber failure
  • Vacuum interlocks remove power from deposition sources to prevent user exposure to high voltage in event of chamber being opened
  • Overheating protection shuts down power supply

Vacuum control

High vacuum turbo pumping allows sputtering of a wide range of oxidizing and non-oxidizing metals for thin film and electron microscopy applications. Automatic vacuum control which can be pre-programmed to suit the process and material, therefore removing the need for manual intervention or control.

Cool magnetron sputtering

Sputter coating is a technique widely used in various applications; it is possible to create a plasma and sputter metals with high voltage, poor vacuum and no automation. However, this is not suitable for some applications because it can heat the substrate and result in damage when the plasma interacts with the substrate. The EMS 300T D Plus uses low temperature enhanced-plasma magnetrons optimized for the turbomolecular pump pressures, combined with low current and deposition control, which ensures your substrate is protected and uniformly coated.

The EMS 300T D Plus uses easy-change, 57 mm diameter, disc-style targets which are designed to sputter oxidizing and noble metals. It is fitted with gold (Au) and chromium (Cr) sputter targets as standard.

Pulsed cleaning for Aluminum sputtering

Aluminum (Al) rapidly forms an oxide layer which can be difficult to remove. The EMS 300T D Plus has a special recipe for Aluminum that reduces the oxide removal time and prevents excessive pre-sputtering of the target.

Film thickness monitor

The EMS 300T D Plus can be fitted with an optional dual film thickness monitor (FTM), which measures the coating thickness on two quartz crystal monitors located within the chamber. The thickness measured on the monitor can be correlated to the thickness on the substrate using a mathematical formula built into the software; this allows the user to control the thickness of material deposited on to the substrate. For example, the EMS 300T D Plus can automatically terminate a coating profile when the required thickness has been achieved. Alternatively, the process can be terminated by time.

Specifications

Instrument case 590 mm W x 535 mm D x 420 mm H, total height with coating head open is 772 mm
Weight 36 kg (Packed 59 kg)
Packed dimensions 730 mm W x 630 mm D x 690 mm H
Work chamber Borosilicate glass 300 mm OD x 127 mm H
Safety shield Integral polyethylene terephthalate (PET) cylinder
Display 115.5 mm W x 86.4 mm H (active area), 640 RGB x 480 (display format), capacitive touch color display
User interface Full graphical interface with touch screen buttons, includes features such as a log of the last 1000 coatings and reminders for when maintenance is due
Specimen stage A flat adjustable stage capable of accepting either 4" or 6" wafers is mounted on a swinging arm stage, which rotates the stage under the targets to optimise coating. Rotation speed is variable from 14 rpm to 38 rpm
Vacuum
Rotary pump 50L/min two stage rotary pump with oil mist filter
Turbo pump Internally mounted 70 L/s air-cooled
Vacuum measurement Pirani gauge as standard, full range gauge available as an option
Ultimate Vacuum 5 x 10-5 mbar
Typical ultimate vacuum of the pumping system in a clean instrument after pre-pumping and venting with dry nitrogen gas
Sputter vacuum range 5 x 10-3 mbar to 5 x 10-2 mbar
Typical ultimate vacuum of the pumping system in a clean instrument after pre-pumping and venting with dry nitrogen gas
Processes
Sputter Deposition Current 150mA
Visual status indicator

A large multi-color status indicator light provides a visual indication of the state of the equipment, allowing users to easily identify the status of a progress at a distance.

The indicator LED shows the following states:

  • Initialization
  • Process running
  • Idle
  • Coating in progress
  • Process completed
  • Process ended in fault condition

Audio indication also sounds on completion of the process.

Services
Gases Process gas Argon, 99.999% Nominal 5psi
Vent gas Nitrogen (optional). Nominal 5psi

Ordering Information

EMS 300T D Plus Dual Target Sequential Sputtering System; includes a 57 mm Ø x 0.3 mm chromium (Cr) target and a 57 mm Ø x 0.1 mm thick gold (Au) target . A flat rotation stage for 4"/100 mm wafers is included. POR Quote
Rotary pump requirements (needs to be ordered separately)
91003 Edwards RV3 50L/s two-stage rotary pump, with vacuum hose, coupling kit and oil mist filter 2,429.00 Add to Cart
6548 XDS 5 Scroll Pump POR Quote
6550-A Diaphragm pump. A "dry" alternative to the standard 91003 oil-based rotary pump complete with vacuum hose, coupling kit and oil mist filter POR Quote
Specimen stages
6790-S Swinging arm stage drive, a stage drive and positioning mechanism which positions the stage under the correct target. Also provides rotation drive to the stage. Rotation Speed Max 38 rpm Min 14 rpm POR Quote
6800-S Rotating specimen stage for 6" (152 mm) wafers, with rotation variable between preset limits. POR Quote
6801 Rotating 50 mm Ø specimen stage with adjustable tilt. The platform has six specimen stub positions for 15 mm, 10 mm, 6.5 mm or ⅛" pin stubs. The stage rotation speed is variable between preset limits. The target to stage height is variable between 0 mm and 42 mm for the standard stage. When used with the extended height cylinder the target to stage height would be an additional 87 mm. POR Quote
6802 50 mm Ø variable height specimen stage with six stub positions for 15 mm, 10 mm, 6.5 mm disc stubs or ⅛" pin stubs. Stage rotation speed variable between preset limits. Note: Target to stage height is variable between 10 mm and 53 mm for the standard stage. The stage is supplied with two mounting pillars; one provides 10 mm to 32 mm target to stage distance and the other 31 mm to 53 mm. An adjustable stop is used to set the height. When used with the extended height cylinder (optional accessory) the target to stage height would be an additional 87 mm. POR Quote
6803 50 mm Ø "Rotacota" stage. A rotary planetary style stage with a variable tilt angle from horizontal to 30 degrees. The platform has six positions for either 6.5 mm, 10 mm and 15 mm disc stubs or ⅛" pin stubs. Rotation speed is variable between preset limits. Note: depending upon specimen height, this stage may require the optional extended height cylinder. POR Quote
6804 A 90 mm Ø specimen stage for glass microscope slides (up to two 75 mm x 25 mm slides or a single 75 mm x 50 mm slide). The stage can alternatively accommodate up to six ⅛" SEM pin stubs. The stage rotation speed is variable between preset limits. A gear box is included to allow the optional FTM to be used. POR Quote
Options and Accessories
6805 Dual channel film thickness monitor (FTM). A fully integrated system using the EMS 300T D Plus touch screen display for the control and display of all FTM functions. The FTM allows for the automatic termination of the metal sputtering process at a pre-selected thickness value. The rate for the sputtering processes is displayed in nm/min, with a resolution of 0.1 nm. Two FTM crystal holders are fixed in the chamber to give optimal position for both targets and to coat one material per crystal. Operating crystal frequency is in the 5 MHz to 400 kHz operating range. Includes two spare quartz crystals POR Quote
6806 Spare quartz crystal. POR Quote
6807 Extended height vacuum chamber (214 mm in height, the standard chamber is 127 mm high). Ideal for increased source to specimen distance and for coating of larger specimens. POR Quote
6808 Rotating vacuum spigot allows more convenient connection of the vacuum hose to the rear of the EMS 300T D Plus when bench depth is limited. POR Quote
6809 A lockable emergency stop (e-stop) switch which can be mounted on top of the system in a position easily accessible for the operator. It is provided with a key to release the knob after activation. Note: the addition of the e-stop does not inhibit or replace the normal On/Off switch function. The e-stop can be retrofitted to existing systems. POR Quote
6810 Full range, active vacuum gauge capable of measurement over the range of 1000 mbar to 5 x 10-9 mbar. Typical ultimate vacuum of the EMS 300T D Plus is 5 x 10-5 mbar. Note: this must be factory fitted. POR Quote
6811 Coating shields. Can be fitted to protect large surfaces from coating deposition and can be easily removable for cleaning. POR Quote
6812 Spares kit, including: spare standard glass cylinder, one chromium (Cr) and one (Au) sputtering target, vacuum tubing with coupling insert, argon gas tubing, two sputter head magnets, rotary pump oil mist filter, FTM quartz crystal and fuses. POR Quote
Sputter targets

Note: The EMS 300T D Plus is fitted with a 57 mm diameter 0.3 mm thick chromium (Cr) target and a 57 mm diameter 0.1 mm thick gold (Au) target as standard. Other optional targets are available:

3409 57 mm Ø x 0.76 mm Aluminum POR Quote
3410 57 mm Ø x 0.1 mm Gold POR Quote
3411 57 mm Ø x 0.1 mm Gold/Palladium (80/20) POR Quote
3411-3 57 mm Ø x 0.3 mm Gold/Palladium (60/40) POR Quote
3412 57 mm Ø x 0.1 mm Platinum POR Quote
3413 57 mm Ø x 0.1 mm Nickel POR Quote
3414 57 mm Ø x 0.1 mm Silver POR Quote
3415 57 mm Ø x 0.1 mm Palladium POR Quote
3416 57 mm Ø x 0.1 mm Copper POR Quote
3417 57 mm Ø x 0.3 mm Chromium POR Quote
3418 57 mm Ø x 0.5 mm Tungsten POR Quote
3419 57 mm Ø x 1.5 mm Chromium POR Quote
3420 57 mm Ø x 0.2 mm Tungsten POR Quote
3421 54 mm Ø x 1.5 mm Carbon POR Quote
3422 57 mm Ø x 0.1 mm Aluminum POR Quote
3423 57 mm Ø x 0.1 mm Platinum/Palladium (80/20) POR Quote
3424 57 mm Ø x 1.5 mm Titanium POR Quote
3425 57 mm Ø x 0.3 mm Platinum/Palladium (80/20) POR Quote
3426 57 mm Ø x 0.3 mm Gold POR Quote
3427 57 mm Ø x 0.3 mm Gold/Palladium (80/20) POR Quote
3428 57 mm Ø x 0.3 mm Platinum POR Quote
3429 57 mm Ø x 0.5 mm Titanium POR Quote
3430 57 mm Ø x 0.1 mm Iron POR Quote
3431-2 57 mm Ø x 0.2 mm Iridium POR Quote
3431 57 mm Ø x 0.3 mm Iridium POR Quote
3432 57 mm Ø x 0.1 mm Cobalt POR Quote
3433 57 mm Ø x 0.1 mm Tin POR Quote
3434 57 mm Ø x 0.1 mm Molybdenum POR Quote
3435 57 mm Ø x 0.3 mm Magnesium POR Quote
3436 57 mm Ø x 0.1 mm Tantalum POR Quote
3437 57 mm Ø x 3 mm Indium Tin Oxide (90/10) POR Quote

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