Cleaving Copper C4 Bumps with LatticeAx

EMS Catalog #7641

Copper Bumps After Cleave

This sample was prepared by using a Multi-tool workflow.

The preparation yielded a high-quality cross section ready for SEM imaging.

After Step 1: SEM		SEM image showing direction on ion mill poilish

The solder bumps were prepared for the SEM in a two-step process.

In Step 1, the LatticeAx™ cleaver was used to cleanly cross-section close to and parallel to a specific row of copper bumps. The copper bumps had a diameter of 85-µm and were cleaved 30-µm from the center of a bump.

The time to cleave was 5 minutes.

After Step 2: SEM after cleave and polish		SEM image through center of bump

In Step 2, a broad, argon, ion-beam instrument, the Hitachi IM4000, was used to prepare the final imaging surface.

The sample was mounted topside down on a sample block to perform backside milling. Backside milling was used to prevent artifacts of ion beam milling that can occur as a result of sample topography. By cleaving close to the center of the copper bumps, the time on the ion mill was minimized. No further preparation was performed.

Additional Technical Data Sheets

Product Information

The LatticeAx™