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Electron Microscopy Sciences

Technical Data Sheets

Dicing Glass Wafers

EMS Catalog #7670

flipscribe

There are many ways to cut glass. Using scribing and breaking methods (as shown in the video) are simple and clean. The user does not need lubricants, but must clean the cutting wheel and pointed scribers frequently. In this method, material is not lost as the cleaving process simply separates the pieces, as compared to a dicing saw wheree material loss would occur. Another important benefit to the scribe and break method is that a toxic waste stream is not produced, and thus no need for disposal.

Product Demonstration

Watch a step-by-step video showing how a 4"/100mm borosilicate glass wafer was diced using the FlexScribe.

Glass Wafer Types

Soda Lime Glass
  • Most common
  • 5-6 Moh's
  • Low resistance to thermal shock
  • Can be tempered to strengthen and increase thermal shock resistance
Borosilicate Glass
  • 5.5 Moh's Scale, Knopp 470
  • Resistant to thermal shock
  • Pyrex from Corning is synonymous for borosilicate glass
Quartz Glass
  • 5.5-6.5 Moh's Scale
  • Low thermal expansion coefficient
  • Resistant to shock
  • Made by fusing low grade synthetic or naturally occuring quartz
  • More impurities than fused silica
Fused Silica
  • 5.5-6.5 Moh's Scale
  • High purity
  • Made by fusing high purity synthetic material
  • Pure used for photonic applications
  • High transmission in the UV compared with quartz

Tips

Scoring/Scribing

You will get the best cut by making a single scribe with gentle, even pressure that produces a fine, visible line on the flass. You do not want to go so deep that fractures are observed.

Cleaving

When you split your pieces after scribing, the highest success and best facets will be obtained if you use the rule of halves. The rule of halves states that your cut is most likely to run straight when you have equal amounts of glass on either side of the scribe. In short, avoid cutting a thin strip off of a large plate of glass.

Product Reccomendations

FlipScribe (up to 4" wafer)
FlexScribe (up to 300 mm wafer, standard borosilicate glass)
FlexScribe Diamond Scribing Wheel (up to 300 mm wafer, quartz glass, thin glass)
Handheld Scribers (general glass cutting)
The Cleaving Station (With everything needed to scribe and cleave using handheld tools)
Cleanbreak Pliers (6") (cleaving class and crystalline substrates)