With one part adhesive it is not for permanent use. Use for testing and temporary work where a high signal is required from the adhesive. Gold content is ~75%, in organic binders and a solvent.
This strong, water-based adhesive has an excellent electrical and thermal conductivity. Dries quickly to an ultra smooth finish in just 15 minutes and is non-hazardous. Water/oil resistant, anti cracking, blocks UVA and has no measurable VOCs.
Removes the polymerized resin as well as the reduced-osmium for good results in positive staining of sections. The structure of the resin free section will remain unchanged.
Aqueous mounting medium with strong anti-fading agent, 1, 4-phenylenediamine (PPD) for preserving fluorescence of tissue and cell smears. Prevents rapid photobleaching of FITC, Texas Red, AMCA, Alexa fluoro 488 and 594, tetramethyly rhodamine, Redox.
An aqueous mounting medium made with glycerol is for preserving fluorescence of tissue and cell smears. Prevents rapid photobleaching of FITC, Texas Red, AMCA, Cy dyes, Alexa fluoro 488, Alexa fluoro 594, GFP, tetramethyly rhodamine and Redox.
Aqueous mounting medium with strong anti-fading agent, 1, 4-phenylenediamine (PPD) for preserving fluorescence of tissue and cell smears. Prevents rapid photobleaching of FITC, Texas Red, AMCA, Alexa fluoro 488 and 594, tetramethyly rhodamine, Redox.
Clear, fast curing cyanoacrylate adhesive is for bonding samples and non-porous materials to similar materials or glass. Clear liquid remover destabilizes and debonds cured cyanoacrylates.
A non-permanent, ready to use low viscosity aqueous mounting medium. For mounting of tissue sections and cell smears with peroxidase and alkaline phosphatase chromogens that cannot be dehydrated with organic solvents
Rapid mounting media for for long life preparations, without bubble formation at high ambient temperatures. Use for dehydrated microscopic preparations. Cure time 20 min at room temp. Colorless with an acid number less than 2.50.
Epo-Tek H20E is a two component, 100% solid silver-filled epoxy system, silver-resin paste and liquid hardener, mixing ration is 1:1. High thermal conductivity suited for high temp applications (300 – 400°C).